Dip&Print Station solder paste and flux application station

Technical specifications

Specifications are taken from the manufacturer’s technical documentation. Updated 11/13/2026.

Description

This station prepares components for rework by applying solder paste or flux in a defined way. It works with the entire family of rework systems it belongs to, including the HR 600 P, HR 600 XL, HR 600/2, HR 550 XL, HR 550 and HR 500, which cover automatic and guided repair of standard, medium-sized and large, complex assemblies. Matching adapters are available for each of these systems.

Optional dip stencils let a component be dipped into flux or a dip-compatible solder paste in a controlled manner. This creates a defined depot of solder on the connections before placement. Standardized dip stencils cover many applications, and component-specific print stencils can be made to customer requirements. Both dipping and printing are supported, and the process is simple, reliable and reproducible.

The stencils can be cleaned and dried directly in the station, so no separate equipment is needed for this step.

The following options are available:

0PR100-D001 Dip stencil 40 x 40 / 300 µm 0PR100-D002 Dip template 20 x 20 / 150 µm 0PR100-D003 Dip template 20 x 20 / 100 µm 0PR100-D004 Dip stencil 40 x 40 / 100 µm 0PR100-R001 Squeegee plate 70 x 25 mm, 0.3 mm thick 0PR100-S001 Print stencil, type 1, BGA 225 0PR100-S002 Print stencil, type 2, MLF 32 0PR100-S003 Print stencil, type 2, QFN 20

Further dip and print stencils are available, and customized stencils can be supplied on request.