HR 550 XL rework system for large boards

Technical specifications

Specifications are taken from the manufacturer’s technical documentation. Updated 11/13/2026.

Description

A semi-automatic, guided rework system for large assemblies up to approx. 530 x 610 mm, the HR 550 XL combines eight bottom radiator heating zones with motorized X/Y fine adjustment and component rotation. It is suitable for industrial and power electronics as well as large-format PCBs and is particularly attractive for service providers. Repairing instead of discarding assemblies maintains value creation: with a rework system, 15–20 assemblies can be reworked per 8-hour shift.

The top heater is a 1,800 W hybrid high-performance heating element combining 900 W infrared and 900 W hot air over a 70 x 70 mm area. Underneath, a full-surface 6,400 W IR underheating (8 x 800 W) covers 530 x 530 mm. The heating technology is gentle, and soldering processes are sensor-guided via three K-type measuring channels and one IRS channel. Components from 0.2 x 0.4 mm (01005) up to 70 x 70 mm can be processed. The typical working distance is 30–60 mm to the top heater and 35 mm to the bottom heater. The working depth is 349 mm, so rotation of the assembly may be necessary.

For precise component placement, a 5 MP GigE colour placement camera provides a field of view of 70 x 70 mm (wide angle) or 25 x 33 mm (telephoto). Alignment is computer-aided with digital "split optics", and a Class II position laser is integrated. Component rotation and X/Y adjustment are motorized with tip operation at a resolution of less than 20 µm, which also supports tasks such as placing a metallic BGA. High-resolution cameras serve both placement and process monitoring. Operation is ergonomically optimized, and the user-friendly HRSoft 2 operating software (Windows 8, 10 and Windows 11) provides clear user guidance and complete process documentation. Residual solder can be removed contactlessly.

The unit measures 755 x 930 x 545/747 mm (W x D x H, heating head bottom/top) and weighs 102 kg including the control panel. It is an antistatic version with a rated power of 8,200 W and a rated voltage of 3 x 400 VAC, 50–60 Hz, 16 A, and carries the CE test mark. It requires an oil-free compressed air supply of 6–10 bar via a ¼ inch quick coupling, and cooling air consumption is approx. 65 l/min at 6 bar. The product may be protected by one or more U.S. patents, including U.S. Patent No. US10217211B2.

Two versions are available: 0HR550XL with a PCB holder of 610 x 530 mm (+x) and 0HR550XLL with a PCB holder of 680 x 600 mm (+x). Recommended accessories include:

- The 0HR510 reflow process camera for HR 500, HR 550 and HR 550 XL, with 2.3 MP, CMOS GigE colour, 25 mm focal length and adjustable 2x LED illumination. - The 0HR550-TF tape feeder for supplying small components. - The 0IR6500-37 AccuTC sensor without mounting, K-type, and the 0IR4510-02 K-type thermal sensor cable, both for the second measuring channel. - The complete 0PR100 Dip&Print Station for defined flux or solder paste application during rework. - The 0SC550 non-contact residual solder removal module, suitable for all HR 550 and HR 550 XL rework systems.