HR 600 XL automatic rework system for XL boards

Technical specifications

Specifications are taken from the manufacturer’s technical documentation. Updated 11/13/2026.

Description

Designed for automatic repair of large and complex assemblies, this rework system handles PCBs up to 625 x 625 mm, optionally up to 625 x 1250 mm, with a board thickness of up to 10 mm. As standard, components from 0.5 x 0.5 to 60 x 60 mm are processed precisely. With the optional XL heating head, the range extends from 0.2 x 0.4 mm (01005) to 150 x 120 mm edge length. Reworking rather than scrapping large, expensive assemblies preserves value, and 15 to 20 assemblies can be reworked per 8-hour shift. The system is individually configurable, and automated process steps reduce operator workload and give reproducible results from the very first process.

Heating heads are exchangeable, covering 800 W to 4,800 W. The standard top heating is a 60 x 60 mm hybrid radiator (0.8 kW), optionally up to 150 x 120 mm (2.8 kW). For big BGA rework, a hybrid heating head with an effective area of 160 x 160 mm and up to 4,800 W delivers the energy needed for soldering and desoldering. The bottom heater is a large-area matrix infrared preheater of 625 x 625 mm with 25 individual 600 W elements, expandable to 625 x 1250 mm with 50 elements. It heats large assemblies gently and evenly. Process monitoring uses up to 8 K-type thermocouple channels plus 1 VTC channel, and process verification is handled by the HRSoft 2 operating software, which runs on Windows 8, 10 and 11.

Components are aligned automatically using image processing. A top 5 MP GigE color camera and a bottom 5 MP GigE monochrome camera each have a 60 x 60 mm field of view. A "pin to pad" placement process allows precise positioning of very large components. A high-precision motorized axis system places components with an accuracy of up to ±0.025 mm. Grippers can be made individually by metal 3D printing to match the component shape. One example is the removal of a BGA with a 134 mm edge length using a gripper with four suction cups.

The Auto Scavenger module is fully integrated and removes residual solder automatically and without contact. Immediately after a component is lifted, its suction nozzle lowers over the PCB and extracts the remaining solder. As a stand-alone module, it requires no set-up time.

The machine measures 2,250 x 1,700 x 1,650 mm (WxDxH) including the monitor holder, occupies 1,691 x 1,180 mm of floor space and weighs approx. 312 kg. It is built as an antistatic version. Rated power is 16 kW, or optionally 16 kW + 15 kW with extended bottom heating, at 3 x 400 VAC, 50-60 Hz, 30 A. It requires oil-free compressed air at 6-10 bar via a ¼ inch quick coupling, with a cooling air volume of approx. 110 l/min at 6 bar. Test mark is CE, with UL optional. The product may be protected by U.S. Patent No. US10217211B2.

Order variants are 0HR600XL with 60 x 60 mm top heating and 0HR600XL-L with 150 x 80 mm top heating. Further options include 0SC600 (SC 600 automatic residual solder removal) and 0HR610XL, a reflow process camera for monitoring the soldering process (5 MP GigE color camera, 25 mm focal length, 2 x LED illumination). Other options are the 0PR100 Dip&Print Station for defined flux or solder paste application, the 0IR6500-01 AccuTC thermocouple, the 0IR6500-37 AccuTC sensor without mounting (K-type) and the 0IR4510-02 K-type thermocouple cable, the last two for the second measuring channel. Other system configurations are available on request.