Microbond solder preforms for power modules

Technical specifications

Specifications are taken from the manufacturer’s technical documentation. Updated 11/13/2026.

Description

These lead-free solder preforms are designed for power module attach, where mechanical, thermal and reliability requirements are especially demanding. Microbond preforms secure power packages to baseplates or coolers and use Innolot alloys to deliver consistent performance under harsh thermal cycling and high-power operating conditions. Their relatively low melting temperature provides high reliability while protecting sensitive components.

Because the solder is supplied as a preform, no paste printing is needed. This eliminates printing waste, reduces material consumption and supports high-throughput manufacturing. The preforms provide a clean, flux-free joining solution with a lead-free (Pb-free) formulation that meets environmental and regulatory standards. Flexible sizing and form factors make them compatible with most module and substrate interconnect applications, including bonding metal substrates to baseplates and modules to coolers. They are also compatible with molded interconnect substrates. Precision manufacturing ensures consistent quality and high design flexibility, and the preforms balance cost and performance for durable, efficient bonding across a wide range of power electronics assemblies.

The product is available in two alloy variants. Microbond Innolot preforms are a proven choice for module attach and substrate attach applications that require long-term reliability. The Innolot composition is optimized for mechanical strength and thermal stability, keeping modules securely attached to baseplates or coolers even under extreme thermal cycling. Its low melting range of 206-218 °C minimizes warpage and protects sensitive components and internal interconnections. This makes it well suited to demanding molded module attach in automotive and industrial power electronics.

Microbond Innolot 2.0 preforms suit applications that must balance performance and cost. This alloy keeps the performance benefits of standard Innolot but contains less precious metal, specifically a reduced silver (Ag) content, which lowers overall material costs. Its melting range of 212-222 °C is only slightly higher than standard Innolot. Innolot 2.0 is recommended for power module interconnections in molded modules or frame modules with multiple substrates, offering a balance of thermal performance, mechanical strength and cost-efficiency.

On a comparative grading scale of good, okay and complex, Innolot rates good for melting temperature, good for reliability and okay for cost. Innolot 2.0 rates okay for melting temperature, good for reliability and good for cost. The two alloys show comparable reliability in temperature cycling tests (TCT) according to AGQ324.

Typical applications include automotive and EV systems, such as inverters, power modules and converters in electric and hybrid vehicles. In new energy, the preforms are used in solar inverters and wind power systems. In industrial electronics, they serve motor drives and high-power industrial control systems.