SOLDERING: SOLDER, FLUXES, SOLDERING EQUIPMENT
NSL low-melting solder alloys
Country: Germany · Model: NSL
Low-melting alloys for soldering heat-sensitive components and for staged (multi-step) soldering.
- Type
- rods / wire
- Alloys
- Bi58Sn42, Bi57Sn42Ag1
Technical specifications
| Type | rods / wire |
|---|---|
| Alloys | Bi58Sn42, Bi57Sn42Ag1 |
Specifications are taken from the manufacturer’s technical documentation. Updated .
Description
Low-melting solder alloys of the NSL group are lead-free solders with melting ranges around 139 °C. They are intended for soldering tasks where the higher processing temperatures of conventional lead-free solders based on SnCu or SnAgCu alloys would place too much thermal stress on the assembly. Because the processing temperatures are lower, the thermal load on the printed circuit board and on the mounted components is reduced.
Two alloy compositions are available: Bi58Sn42, a bismuth-tin alloy, and Bi57Sn42Ag1, a bismuth-tin alloy with a silver content of 1 %. Both share the low melting point around 139 °C. The solders are supplied as rods and wire.
The alloys offer good wetting characteristics and are fast flowing, which supports reliable joint formation at the reduced process temperature. They are well suited for temperature-sensitive components that cannot tolerate the thermal profile of standard lead-free soldering. Both alloys are lead-free and RoHS compliant.
Bi58Sn42 and Bi57Sn42Ag1 are used in wave, selective and dip soldering systems. A technical datasheet with further alloy and processing data is available for both compositions.
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