Sn60Pb40, Sn63Pb37, Sn64Pb36 high-purity tin-lead solder bars

Technical specifications

Specifications are taken from the manufacturer’s technical documentation. Updated 11/13/2026.

Description

These high-purity tin-lead soft solder bars are available in the alloys Sn60Pb40, Sn63Pb37 and Sn64Pb36. They are produced to an in-house specification and contain significantly lower impurities than alloys made to Sn60Pb40E or Sn63Pb37E under ISO 9453. Production starts from ultra-pure metals, followed by additional processing that removes residual impurities that conventional solder alloys may still contain.

The range includes two refined grades. In the first, an additional refining process removes non-metallic impurities. In the second, a special treatment removes impurities such as oxides and sulphides that may remain in other alloys. As a result, the second grade has a reduced oxidation rate and forms less dross than conventional alloys.

Both grades wet better than standard alloys, even when the solder bath runs slightly below its usual operating temperature. Working at a lower bath temperature reduces the risk of damage to heat-sensitive components. The excellent flow characteristics produce clean, well-formed solder joints and keep soldering defects to a minimum.

The first grade, offered as Sn63Pb37, is particularly suitable for wave soldering of SMD-equipped printed circuit boards. This application demands very low viscosity, high assembly density, reduced solder application, and the lowest possible metal impurity and oxide content. It is preferably used in wave soldering machines operated with protective gas.

All variants are supplied as bars for charging and topping up solder baths. The choice between Sn60Pb40, Sn63Pb37 and Sn64Pb36 allows the alloy to match the requirements of the soldering process and the existing bath composition.