TC/TC300/TSC/TSC305/TSC0307 lead-free solder bars

Technical specifications

Specifications are taken from the manufacturer’s technical documentation. Updated 11/13/2026.

Description

This range of lead-free solder bars covers five alloys for wave soldering, selective soldering and related electronics manufacturing processes. The grades TC, TC300, TSC, TSC305 and TSC0307 correspond to the alloys Sn99.3Cu0.7, Sn97Cu3, Sn95.5Ag3.8Cu0.7, Sn96.5Ag3Cu0.5 and Sn99Cu0.7Ag0.3. The alloys are manufactured from pure metals and were developed to eliminate tin/lead alloys from all existing production processes in electronics manufacturing, ensuring a lead-free soldering process. They can replace eutectic or near-eutectic tin/lead or tin/lead/silver alloys.

TC (Sn99.3Cu0.7) is a eutectic lead-free solder according to ISO 9453, alloy number 401, with a defined melting point of 227 °C. As a pure tin/copper alloy, it is patent-free, so no licence fees apply. It offers good wetting characteristics and costs less than conventional silver-containing solders because it contains no silver. TC300 (Sn97Cu3) is used mainly for tinning wire strands. The resulting joints are comparable in all respects to those made with Sn/Pb solders.

TSC (Sn95.5Ag3.8Cu0.7) is a eutectic lead-free solder according to ISO 9453, alloy number 713. With a melting point of 217 °C, it has the lowest melting point of all alloys with a high tin content. It provides improved wetting characteristics. As a wave solder, it requires a solder bath temperature of approx. 260 to 280 °C.

TSC305 (Sn96.5Ag3Cu0.5) is a lead-free solder according to ISO 9453, alloy number 711, with a melting range of 217 to 222 °C and good wetting characteristics. Its reduced copper content gives it a longer service life. Its silver content is 0.8 % lower than that of the eutectic SnAgCu alloy, which makes it more economical. For wave soldering, a solder bath temperature of approx. 260 to 265 °C is required. Using inert gas significantly extends the process window and improves wetting, and no excess solder remains on the components as they exit the wave. TSC305 can also be used in selective soldering systems.

TSC0307 (Sn99Cu0.7Ag0.3) is a low-silver lead-free solder according to ISO 9453, alloy number 501. It can replace eutectic or near-eutectic tin-silver-copper alloys while offering almost identical processing properties. With a silver content of only 0.3 %, it reduces silver costs by up to 90 %, making it significantly more economical than conventional silver-containing solders. The alloy has a melting range of 217 to 226 °C, good wetting characteristics and improved dissolution behaviour compared with Sn99Cu1 alloys. As a wave solder, it requires a solder bath temperature of approx. 225 to 270 °C.