ES550, ES558, ES562, ES569, ES578 one-component heat-cure epoxy adhesives

Technical specifications

Specifications are taken from the manufacturer’s technical documentation. Updated 11/10/2026.

Description

The absence of mixing removes dosing errors and gives unlimited assembly time at room temperature. Oven cure takes 45–60 minutes at 150 °C, and with induction heating of the ES550 less than 3 minutes. The ES550 is a toughened silver-gray paste that does not flow during cure (1–2 million mPa·s). It gives 27–41 MPa on steel, 17–31 MPa on aluminum, 14–27 MPa on zinc and over 14 MPa on a steel–ferrite pair. Tg is 120 °C, modulus of elasticity 4.8 GPa, elongation less than 3 %, impact strength 25–35 kJ/m², thermal conductivity 0.55 W/(m·K), gap up to 5 mm, density 1.5. The ES558 is also toughened, but becomes flowable when heated and flows into gaps, the ES562 is white and flowable (15 000–25 000 mPa·s, 20–35 MPa), and the ES569 is high-strength and non-sagging. The ES578 has high thermal conductivity for removing heat from power electronics when bonding metals and ceramics (8–12 MPa).

How to choose

The grade is selected by the behavior of the seam during heating and by the load. For maximum strength and impact resistance take the ES550, and when the seam must not run, also the ES569. For thin gaps, for example in heat exchangers, the flowable ES558 or ES562 is needed. For power electronics, where it is important to remove heat, the ES578 is chosen, taking into account its lower strength of 8–12 MPa. Substrates can be metals, ferrites, ceramics and composites. If heating is impossible, see the two-component epoxies of the ET series.